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LED package specific classification


LED package specific classification

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  According to different applications, different dimensions, cooling solutions and lighting effects. LED packages come in a variety of forms. At present, LEDs are mainly classified into Lamp-LED, TOP-LED, Side-LED, SMD-LED, High-Power-LED, Flip Chip-LED, etc.

Lamp-LED (vertical LED)
    Lamp-LEDs appeared early in the form of in-line LEDs, and their packages were in the form of potting. The potting process is to first inject liquid epoxy resin into the LED molding cavity, then insert the pressure-bonded LED bracket into the oven to cure the epoxy resin, and then remove the LED from the cavity to form. Due to the relatively simple manufacturing process and low cost, it has a high market share.
SMD-LED (surface adhesion LED)
    The SMD LED is attached to the surface of the circuit board. It is suitable for SMT processing and can be reflowed. It solves the problems of brightness, viewing angle, flatness, reliability and consistency. It uses a lighter PCB board and reflective layer material. The improvement removes the carbon steel material pins that are directly inserted into the LED, so that the display reflective layer needs to be filled with less epoxy resin, in order to reduce the size and reduce the weight. In this way, surface mount LEDs can easily reduce the weight of the product by half, ultimately making the application perfect.
Side-LED (side-emitting LED
    At present, another focus of the LED package is the side-emitting package. If you want to use the LED as the backlight source of the LCD (liquid crystal display), then the side illumination of the LED needs to be the same as the surface illumination, so that the LCD backlight can be evenly illuminated. Although the design of the lead frame is used, the side illumination can also be achieved, but the heat dissipation effect is not good. However, Lumileds invented the design of the mirror, using the mirror principle to generate sidelights, and successfully applying high-power LEDs to large-size LCD backlight modules.
    The top-emitting LED is a relatively common patch-type LED. Mainly used in backlights and status indicators in multi-function ultra-thin mobile phones and PDAs.
High-Power-LED (High Power LED)
    In order to obtain high-power, high-brightness LED light sources, manufacturers are developing in the direction of high power in LED chip and package design. Currently, LED packages capable of withstanding several W power have emerged. For example, the package structure of the Norlux series of high-power LEDs is a multi-chip combination of a hexagonal aluminum plate as a base (making it non-conductive), the base diameter is 31.75 mm, and the light-emitting area is located at the center thereof, and the diameter is about (0.375×25.4) mm. It can accommodate 40 LED dies, and the aluminum plate acts as a heat sink at the same time. This package uses a conventional high-density package with high efficiency, low luminous efficiency, low thermal output, and high light output power at high current. It is also a promising LED solid-state light source.
    It can be seen that the thermal characteristics of the power LED directly affect the working temperature, luminous efficiency, luminous wavelength, and service life of the LED. Therefore, the packaging design and manufacturing technology of the power LED chip are more important.
Flip Chip-LED
    The LED flip chip package structure is basically formed with a plurality of through holes in the PCB, and each of the perforations on one side of the substrate is provided with two different regions and mutually open conductive materials, and the conductive material is tiled on the substrate. On the surface, a plurality of unpackaged LED chips are placed on each of the perforations on one side of the conductive material, and the positive and negative contacts of the single LED chip are respectively connected to the conductive material on the surface of the substrate by using solder balls, and The surface of the side of the plurality of LED chips facing the perforation is dotted with a transparent material, and the encapsulant is in the shape of a half sphere at each perforation. It belongs to flip-chip structure light-emitting diode.