Nowadays, the rapid popularization of digital home appliances and flat-panel displays, coupled with the continuous decline in the cost of LEDs, has led to the expansion of the range of LED applications and the willingness to adopt LEDs. Among them, LCD panel manufacturers are facing the guidance of hazardous substances issued by the European Union. (RoHS: Restriction of Hazardous Substances Directive), and the development policy of mercury-based cold cathode fluorescent lamps (CCFL: Cold Cathode Fluorescent Lamp) must be developed in the future. As a result, the demand for high-power LEDs is even more urgent.
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Detailing today's LED packages
Technically, high-power LED packaged products are very difficult to use during heat dissipation. In this context, products with high cost efficiency and high heat dissipation package substrates such as metal-based substrates are becoming more and more efficient. A high-profile focus. Epoxy resin does not meet high power requirements
In the past, the output power of LEDs was small, and the substrate can be packaged with a glass epoxy resin such as a conventional FR4. However, the luminous efficiency of high-power LEDs for illumination is only 20% to 30%, and the chip area is very small, although the overall power consumption is very low, The heat per unit area is very large.
Automobiles, lighting and general people's livelihoods have begun to actively review the applicability of LEDs. The characteristics expected by high-power LEDs are power saving, high brightness, long life and high color reproducibility, which means high heat dissipation is high. The power LED package substrate is indispensable.
Most of the heat dissipation limits of resin substrates only support LEDs of 0.5 W or less. LED packages of more than 0.5 W are mostly replaced with metal-based and ceramic-based high-heat-dissipating substrates. The main reason is that the heat dissipation of the substrate has a direct impact on the lifetime and performance of the LED. Therefore, the package substrate is a very important component in designing high-luminance LED products.
The metal-based high-heat-dissipating substrate is divided into two types: a rigid and a flexible substrate. The hard-based substrate belongs to a conventional metal substrate. The thickness of the metal substrate is usually greater than 1 mm, and is widely used in LED lamp modules and illumination. The module, technically it has the same level of high thermal conductivity extension as the aluminum substrate, and is expected to be used in high power LED packages in the future.
The flexible substrate is used to meet the requirements of thinning of a medium-sized LCD backlight module such as a car navigation system and the requirement of a high-power LED three-dimensional package, and the flexibility of the package substrate can be imparted by thinning the aluminum substrate. A high-power LED package substrate having high thermal conductivity and flexibility is formed.